【阿里云携手联发科，打造手机芯片端侧AI新纪元】近日，科技巨头阿里云与全球知名芯片制造商联发科达成战略合作，成功将阿里云的通义千问大模型适配到联发科的天玑9300等旗舰手机芯片上，实现了大模型在移动端的深度优化。这一突破标志着AI技术在移动设备上的应用迈入新阶段。
联发科官方宣布，通义千问大模型能够在天玑9300芯片上离线运行，支持多轮次的人工智能对话，无需依赖云端服务，极大地提升了用户在隐私保护和低延迟交互方面的体验。这一创新技术将为全球手机用户提供更为智能、快速且安全的AI服务。
阿里云方面表示，双方将深化合作，共同向全球手机厂商推广这一端侧大模型解决方案，旨在推动整个移动设备行业的智能化进程。这一合作不仅将改变手机芯片的功能边界，也将对移动应用生态产生深远影响，为用户带来更为智能、无缝的交互体验。
此次合作彰显了阿里云在AI技术研发与应用领域的领先地位，以及联发科在芯片设计与优化上的专业实力。双方的强强联合，预示着未来智能手机将拥有更强大的AI处理能力，为移动通信和人工智能的融合开启了新的可能。
英语如下：
**News Title:** “Alibaba Cloud and MediaTek Set a New Standard: Dimensity 9300 Chips Feature Qwen on the Edge, Marking a New Era for AI in Mobile Chips”
**Keywords:** Alibaba Cloud MediaTek collaboration, Dimensity 9300, Edge-side AI conversation
**News Content:** **Alibaba Cloud and MediaTek Join Forces to Revolutionize AI in Mobile Chips** Recently, tech giant Alibaba Cloud has entered into a strategic partnership with renowned chip manufacturer MediaTek, successfully adapting Alibaba Cloud’s large language model Qwen for MediaTek’s flagship Dimensity 9300 mobile chips, realizing deep optimization of the model for mobile devices. This breakthrough signifies a new chapter in the application of AI technology on mobile devices.
MediaTek officially announced that the Qwen model can run offline on the Dimensity 9300, enabling multi-turn AI conversations without reliance on cloud services. This enhances user experience in privacy protection and low-latency interactions. This innovative technology will provide global smartphone users with smarter, faster, and more secure AI services.
Alibaba Cloud stated that the two companies will deepen their collaboration to promote this edge-side large model solution to global smartphone manufacturers, aiming to advance the智能化 process across the mobile device industry. This partnership not only redefines the capabilities of smartphone chips but will also have a profound impact on the mobile application ecosystem, offering users a smarter and more seamless interactive experience.
This collaboration underscores Alibaba Cloud’s leading position in AI research and application, as well as MediaTek’s expertise in chip design and optimization. Their combined strengths foreshadow smartphones with enhanced AI processing capabilities, opening new possibilities for the integration of mobile communications and artificial intelligence.
【来源】https://www.ithome.com/0/758/570.htm
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