在即将于明日举行的2024年全球GPU技术大会（GTC）主题演讲中，英伟达预计将揭开其新一代GPU架构——Blackwell的神秘面纱。据业界爆料者XpeaGPU透露，英伟达的Blackwell系列GPU将采用先进的技术，旨在提升性能并优化能源效率。
具体来说，首发的B100 GPU将搭载两个基于台积电CoWoS-L封装技术的计算芯片，这是一种创新的2.5D封装工艺，能实现芯片的高效堆叠，从而在节省空间的同时增强处理能力。据报导，B100 GPU将配备8个8-Hi HBM3e高速显存堆栈，总计192GB的显存容量。这一配置与AMD的Instinct MI300 GPU相当，后者也提供了192GB的显存，采用8个HBM3芯片。
更令人期待的是，XpeaGPU还暗示了一款代号为B200的Blackwell GPU升级版，其显存容量将达到惊人的288GB。虽然未明确指出是HBM3e还是HBM4技术，但这一升级无疑将显著提升数据处理和存储能力，为高性能计算和人工智能应用提供更为强大的支持。明日的英伟达GTC主题演讲将为我们带来更多关于Blackwell架构的详细信息，敬请关注。
英语如下：
News Title: “NVIDIA GTC 2024 Teaser: Jensen Huang可能推出192GB B100 GPU, Challenging AMD’s Memory Record”
Keywords: NVIDIA GPU, Blackwell Architecture, HBM3e Memory
News Content: In the keynote address at the upcoming 2024 Global GPU Technology Conference (GTC) tomorrow, NVIDIA is expected to unveil its next-generation GPU architecture, codenamed Blackwell. According to industry insider XpeaGPU, NVIDIA’s Blackwell series GPUs will leverage advanced technology aimed at boosting performance and optimizing energy efficiency.
Specifically, the debut B100 GPU is rumored to feature two compute chips based on TSMC’s CoWoS-L packaging technology, an innovative 2.5D packaging method that allows for efficient chip stacking, enhancing processing power while conserving space. Reports suggest that the B100 GPU will be equipped with eight 8-Hi HBM3e high-speed memory stacks, totaling 192GB of graphics memory. This matches AMD’s Instinct MI300 GPU, which also offers 192GB of memory utilizing eight HBM3 chips.
Adding to the anticipation, XpeaGPU hints at a Blackwell GPU upgrade, codenamed B200, with an impressive 288GB of memory. Although it’s unclear whether this will utilize HBM3e or HBM4 technology, the upgrade is sure to significantly enhance data processing and storage capabilities, providing stronger support for high-performance computing and AI applications. Tomorrow’s NVIDIA GTC keynote will shed more light on the details of the Blackwell architecture; stay tuned.
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