全球半导体行业迎来重大合作，SK海力士与台积电这两家业界巨头于当地时间周五宣布，双方已签署谅解备忘录，将共同致力于开发第六代高带宽内存（HBM）产品——HBM4芯片。这一合作标志着业界在先进封装技术上的新突破，预期新芯片将于2026年投入生产。
SK海力士，作为全球领先的内存解决方案提供商，与台积电，全球知名的半导体代工巨头，此次携手旨在整合HBM与逻辑层的先进技术，以提升芯片的性能和效率。HBM4芯片的开发将进一步推动高性能计算、人工智能和数据中心等领域的发展，满足市场对更高数据传输速度和更大存储容量的需求。
双方表示，此次合作旨在应对日益增长的高性能计算需求，通过共享资源和技术，加速HBM4芯片的创新与商业化进程。预计新产品的推出将重塑行业标准，为全球半导体市场带来新的竞争格局。
此次合作对于两家公司而言，不仅是技术层面的互补，更是全球半导体产业链深度整合的体现。随着2026年投产日期的临近，业界对于HBM4芯片的期待值正在升温，相信这将为全球科技行业带来深远影响。
英语如下：
**News Title:** “SK Hynix and TSMC Join Forces to Launch Innovative HBM4 Chips in 2026”
**Keywords:** SK Hynix, TSMC, HBM4 Chips
**News Content:**
In a major collaboration in the global semiconductor industry, SK Hynix, a leading memory solutions provider, and TSMC, a renowned semiconductor foundry giant, jointly announced on Friday (local time) that they have signed a memorandum of understanding to co-develop the sixth-generation High Bandwidth Memory (HBM) product, the HBM4 chip. This partnership marks a new breakthrough in advanced packaging technology, with the new chip expected to enter production in 2026.
SK Hynix, known for its advanced memory solutions, and TSMC, with its dominant position in contract manufacturing, aim to integrate cutting-edge HBM and logic layer technologies to enhance chip performance and efficiency. The development of HBM4 chips will further propel advancements in high-performance computing, artificial intelligence, and data centers, catering to the market’s demand for higher data transfer speeds and larger storage capacities.
Both companies expressed that this collaboration targets the escalating need for high-performance computing, as they intend to accelerate the innovation and commercialization of HBM4 chips through resource and technology sharing. The introduction of this new product is anticipated to redefine industry standards and reshape the global semiconductor market dynamics.
This alliance not only signifies a互补 of technologies but also demonstrates a deep integration within the global semiconductor supply chain. As the 2026 production date approaches, anticipation for the HBM4 chips is on the rise, expected to have a profound impact on the global tech industry.
【来源】https://www.cls.cn/detail/1652041
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