在2024年的国际固态电路会议（ISSCC）上，全球领先的半导体制造商台积电披露了其在高性能计算与人工智能（AI）芯片封装技术的最新突破。该公司在已有的3D封装技术基础上，融合了先进的硅光子技术，以优化芯片间的互联性能并降低能耗。
据台积电业务开发资深副总裁张晓强介绍，这项创新的封装技术旨在应对日益增长的高性能计算需求和AI应用的复杂性。通过整合硅光子技术，台积电能够更有效地封装更多的高带宽内存（HBM）和Chiplet小芯片，从而显著提升AI芯片的运算速度和能效。
台积电的这一举措预示着芯片设计和制造的新篇章，它将不仅提高数据中心和云计算的处理能力，还将在AI推理和训练等领域带来革命性的提升。此项技术的推出，进一步巩固了台积电在全球半导体行业的领先地位，并可能对未来的科技发展产生深远影响。
英语如下：
News Title: “TSMC Breaks New Ground with Innovative Packaging Tech, Integrating Silicon Photonics for High-Performance AI Chips”
Keywords: TSMC, new packaging technology, AI chips
News Content: At the 2024 International Solid-State Circuits Conference (ISSCC), TSMC, the world’s leading semiconductor manufacturer, revealed its latest breakthrough in high-performance computing and artificial intelligence (AI) chip packaging technology. The company has integrated advanced silicon photonics into its existing 3D packaging technology to enhance interchip connectivity and reduce power consumption.
According to Dr. Xiaoqiang Zhang, TSMC’s Senior Vice President of Business Development, this innovative packaging technology aims to address the growing demand for high-performance computing and the complexity of AI applications. By incorporating silicon photonics, TSMC can more effectively package higher bandwidth memory (HBM) and Chiplet microchips, significantly boosting the speed and energy efficiency of AI chips.
This move by TSMC signals a new chapter in chip design and manufacturing. It is set to not only enhance data center and cloud computing capabilities but also bring revolutionary improvements in AI inference and training. The introduction of this technology further solidifies TSMC’s leading position in the global semiconductor industry and is poised to have a profound impact on future technological developments.
【来源】https://www.cls.cn/detail/1601181
Views: 1