三星电子近日宣布，为提升在人工智能（AI）领域的半导体竞争力，公司已组建了一个专注于高性能内存（HBM）产能和质量提升的团队，由DRAM产品与技术负责人Hwang Sang-joon领导。这一举措标志着三星在其DS部门实施的双轨AI半导体策略的实质性推进。
据部门负责人庆桂显在社交媒体上的透露，三星的目标是同时增强AI专用存储芯片和AI算力芯片的市场地位。在AI存储芯片领域，新成立的HBM团队将是今年三星建立的第二个专门团队，凸显了其对这一领域的重视。HBM内存因其高带宽和低功耗特性，对于AI推理芯片如Mach-2的性能提升至关重要。
三星的Mach-2芯片开发预计将受益于新团队的专业支持，加速技术突破和市场部署。这一战略调整不仅体现了三星对AI技术发展趋势的敏锐洞察，也显示了其在全球半导体市场的雄心壮志，旨在通过技术创新保持领先地位，满足不断增长的AI应用需求。
随着全球AI产业的快速发展，三星电子的这一举措预示着其将在AI芯片市场的竞争中抢占先机，进一步巩固其在半导体行业的领导地位。未来，三星的HBM内存产能和质量提升将直接影响到AI计算效率，为数据中心、云计算以及人工智能应用提供更强大的硬件支撑。
英语如下：
**News Title:** “Samsung Accelerates AI Chip Development, Establishes HBM Capacity Improvement Team, Targets Global Semiconductor Market”
**Keywords:** Samsung AI strategy, HBM team, Mach-2 development
**News Content:**
Samsung Electronics recently announced that it has formed a team focused on enhancing the production capacity and quality of High-Bandwidth Memory (HBM) to boost its competitiveness in the artificial intelligence (AI) semiconductor sector. Led by DRAM product and technology head Hwang Sang-joon, this move signals a concrete step forward in Samsung’s dual-track AI semiconductor strategy within its DS division.
According to department head Kyung Kye-hyun’s revelations on social media, Samsung aims to strengthen its position in both AI-specific storage chips and AI processing chips. With the new HBM team being the second dedicated team established this year by Samsung for AI storage, it underscores the company’s commitment to the domain. HBM memory, known for its high bandwidth and low power consumption, is crucial for enhancing the performance of AI inference chips like the Mach-2.
Samsung’s Mach-2 chip development is expected to benefit from the specialized support of the new team, accelerating technological breakthroughs and market deployment. This strategic shift demonstrates Samsung’s keen understanding of AI technology trends and its ambitious goals in the global semiconductor market, as it seeks to maintain its leading position through innovation to meet growing AI application demands.
As the global AI industry experiences rapid growth, Samsung’s move positions the company to gain a competitive edge in the AI chip market, further solidifying its leadership in the semiconductor industry. The future enhancements in Samsung’s HBM memory capacity and quality will directly impact AI computing efficiency, providing stronger hardware support for data centers, cloud computing, and AI applications.
【来源】https://www.ithome.com/0/759/317.htm
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