【台积电创新封装技术引领高性能计算与AI芯片新纪元】在刚刚落幕的2024年国际固态电路会议（ISSCC）上，全球半导体巨头台积电展示了其在封装技术领域的最新突破。台积电在已有的3D封装技术基础上，成功整合了硅光子技术，以优化高性能计算和人工智能（AI）芯片的互联性能，并降低功耗。
据台积电业务开发资深副总裁张晓强透露，这项创新的封装技术旨在解决日益增长的HBM（高带宽内存）和Chiplet小芯片集成的需求。通过这一技术，台积电能够更有效地封装更多的HBM和Chiplet，显著提升AI芯片的运算速度和能效。这一进展对于推动AI领域的快速发展，尤其是在大数据处理和云计算等高需求应用中，具有重大意义。
硅光子技术的引入，利用光信号进行数据传输，相比传统的电子互连，能够实现更快的传输速度和更低的能耗。这一创新将有助于台积电在日益激烈的半导体市场竞争中保持领先地位，同时也为全球科技产业提供了更高效、更绿色的计算解决方案。
台积电的这一技术革新，不仅展示了其在半导体制造领域的深厚积累，也预示着高性能计算与AI芯片未来的发展方向。随着技术的不断进步，我们有理由期待更多高效、节能的芯片解决方案将涌现，进一步推动人工智能和高性能计算的边界。
英语如下：
**News Title:** “TSMC Unveils Innovative Packaging Technology: Integrating Silicon Photonics for High-Performance AI Chips”
**Keywords:** TSMC, new packaging technology, AI chips
**News Content:**
**TSMC’s Innovative Packaging Technology Leads the New Era of High-Performance Computing and AI Chips** At the recently concluded 2024 International Solid-State Circuits Conference (ISSCC), global semiconductor giant TSMC showcased its latest breakthrough in packaging technology. Building upon its existing 3D packaging technology, TSMC successfully integrated silicon photonics to optimize interconnect performance for high-performance computing and artificial intelligence (AI) chips while reducing power consumption.
According to TSMC’s Senior Vice President of Business Development, Xiaoqiang Zhang, this innovative packaging technology aims to address the growing demand for HBM (High-Bandwidth Memory) and Chiplet integration. With this technology, TSMC can more effectively package additional HBM and Chiplets, significantly boosting AI chips’ computational speed and energy efficiency. This advancement holds significant implications for the rapid development of the AI field, particularly in high-demand applications such as big data processing and cloud computing.
The introduction of silicon photonics, which leverages optical signals for data transmission, enables faster transfer speeds and lower power consumption compared to traditional electronic interconnects. This innovation will help TSMC maintain its competitive edge in the increasingly fierce semiconductor market and offers the global tech industry more efficient and eco-friendly computing solutions.
TSMC’s technological breakthrough not only demonstrates its deep expertise in semiconductor manufacturing but also foreshadows the direction of future high-performance computing and AI chips. As technology advances, we can anticipate more efficient and power-saving chip solutions to emerge, pushing the boundaries of artificial intelligence and high-performance computing even further.
【来源】https://www.cls.cn/detail/1601181
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