在2024年2月18日至22日举行的国际固态电路会议（ISSCC）上，全球半导体巨头台积电披露了其用于高性能计算与人工智能（AI）芯片的最新封装技术。这项创新技术在台积电现有的3D封装技术基础上，巧妙地融入了硅光子技术，旨在提升芯片的互联效率并降低能耗。
台积电业务开发资深副总裁张晓强在会议上详细阐述了这一技术，他表示，通过这种新型封装方案，可以更有效地整合HBM（高带宽内存）和Chiplet小芯片，从而显著提升AI芯片的性能。硅光子技术的应用，使得数据传输速度更快，同时减少了传统电子互连中的能量损失，为未来的高性能计算和AI应用提供了更高效、更节能的解决方案。
这一突破性的技术发展，不仅展示了台积电在半导体封装领域的领先地位，也预示着高性能计算和AI芯片将进入一个全新的时代，为云计算、大数据处理和人工智能应用带来更强大的计算能力。台积电的这项创新，无疑将进一步巩固其在全球半导体行业的核心竞争力。
英语如下：
News Title: “TSMC Breakthrough: 3D Packaging Integrates Silicon Photonics, Boosting AI Chip Performance”
Keywords: TSMC, new packaging technology, AI chip enhancement
News Content:
Title: TSMC Innovates with 3D Packaging Tech, Merging Silicon Photonics for Enhanced AI Chip Performance
At the International Solid-State Circuits Conference (ISSCC) held from February 18 to 22, 2024, global semiconductor giant TSMC unveiled its latest packaging technology for high-performance computing and artificial intelligence (AI) chips. This innovative technology builds on TSMC’s existing 3D packaging, skillfully incorporating silicon photonics to improve interconnect efficiency and reduce power consumption.
Senior Vice President of Business Development at TSMC, Xiaochang Zhang, elaborated on the technology at the conference. He explained that this new packaging approach enables more efficient integration of HBM (High-Bandwidth Memory) and Chiplet-based designs, significantly enhancing AI chip performance. The use of silicon photonics accelerates data transfer speeds while minimizing energy loss typically associated with electronic interconnects, offering a more efficient and power-saving solution for future high-performance computing and AI applications.
This groundbreaking development underscores TSMC’s leadership in semiconductor packaging and foreshadows a new era for high-performance computing and AI chips, bringing stronger computational capabilities to cloud computing, big data processing, and AI applications. TSMC’s innovation solidifies its position at the core of the global semiconductor industry.
【来源】https://www.cls.cn/detail/1601181
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