近日，联发科宣布其旗舰级天玑9300手机芯片已成功适配通义千问大模型，实现大模型在手机芯片端的深度集成。据悉，这是业界首次将大型AI模型直接部署在手机芯片上，即使在离线状态下也能支持多轮AI对话，为用户带来全新的智能交互体验。阿里云表示，将与联发科进行深度合作，向全球手机制造商提供端侧大模型解决方案，推动智能手机智能化水平的进一步提升。
Title: MediaTek’s Flagship Chip Integrates Tongyi Qianwen Large Model
Keywords: MediaTek, Chip Adaptation, Edge Large Model
News content:
Recently, MediaTek announced that its flagship Dimensity 9300 smartphone chip has successfully integrated the Tongyi Qianwen large model, achieving deep integration of large-scale AI models on smartphone chips for the first time. The integration allows for multi-round AI conversations even in offline mode, providing users with a new level of intelligent interaction. Alibaba Cloud stated that it will collaborate with MediaTek to provide global smartphone manufacturers with edge large model solutions, further enhancing the level of smartphone intelligence.
【来源】https://www.ithome.com/0/758/570.htm
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