SK海力士加大HBM产能，瞄准AI市场
韩国半导体巨头SK海力士宣布，将大幅增加其高带宽内存（HBM）产能，以满足不断增长的AI应用需求。
SK海力士计划将通过硅通孔（TSV）相关的设施投资增加一倍以上，力图将HBM产能翻倍。该公司还计划在2024年上半年开始生产其第五代HBM产品HBM3E。
HBM是一种高性能内存，通过硅通孔技术将DRAM芯片堆叠在一起，从而实现极高的带宽和低延迟。它广泛应用于高性能计算、人工智能和图形处理等领域。
随着AI技术的快速发展，对HBM的需求激增。AI模型需要处理大量的数据，而HBM的高带宽和低延迟特性可以显著提高训练和推理效率。
SK海力士是全球领先的HBM供应商之一。该公司表示，此次产能扩张将使其能够满足不断增长的市场需求，并巩固其在HBM领域的领先地位。
HBM3E是SK海力士的第五代HBM产品，具有更高的带宽和更低的功耗。它将进一步提升AI应用的性能，并为下一代数据中心和高性能计算系统提供支持。
SK海力士的HBM产能扩张反映了该公司对AI市场的信心。随着AI技术的持续发展，HBM将成为关键的使能技术，推动新一代创新和应用。
英语如下：
**Headline:** SK Hynix Doubles Down on AI: HBM Capacity to Double, HBM3E to Be Mass Produced Next Year
**Keywords:** AI Chip, HBM Capacity, High Performance
**Article:**
SK Hynixto Boost HBM Capacity, Targeting AI Market
South Korean semiconductor giant SK Hynix has announced that it will significantly increase its high-bandwidth memory (HBM) production capacity to meet the growing demand from AI applications.
SK Hynix plans to more than double its HBM capacity by investing in through-silicon via(TSV)-related facilities. The company also plans to start mass producing its fifth-generation HBM product, HBM3E, in the first half of 2024.
HBM is a high-performance memory that stacks DRAM chips together using TSV technology, enabling extremely high bandwidth and low latency. It is widely used in applications such as high-performance computing, artificial intelligence, and graphics processing.
With the rapid advancement of AI technology, the demand for HBM has surged. AI models require processing massive amounts of data, and HBM’s high bandwidth and low latency can significantly improve training and inference efficiency.
SK Hynix is one of the world’s leading suppliers of HBM. The company said that the capacity expansion will allow it to meet the growing market demand and solidify its leadership in the HBM segment.
HBM3E is SK Hynix’s fifth-generation HBM product, featuring higher bandwidth and lower power consumption. It will further enhance the performance of AI applications and support next-generation data centers and high-performance computing systems.
SK Hynix’s HBM capacity expansion reflects the company’s confidence in the AI market. As AI technology continues to evolve, HBM will become a critical enabling technology, driving new generations of innovation and applications.
【来源】https://wallstreetcn.com/articles/3707318
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