Semron 获 790 万美元种子轮融资，打造革命性 3D AI 芯片
总部位于德国慕尼黑的半导体初创公司 Semron 近日宣布，已完成 730 万欧元（约合 790 万美元）的种子轮融资。此轮融资由 Join Capital 领投，SquareOne、OTB Ventures、Hermann Hauser 的 Onsight Ventures 和现有投资者跟投。
Semron 致力于开发突破性的 3D AI 芯片技术，旨在变革智能设备的半导体领域。该公司表示，其技术将通过在单个芯片上集成 3D 存储和计算，从而显著提高 AI 处理效率和降低功耗。
Semron 的 3D AI 芯片将广泛应用于各种智能设备，包括智能手机、自动驾驶汽车、物联网设备和医疗器械。该公司表示，其技术将使这些设备能够以更高的能效处理更复杂的任务，从而实现更智能、更强大的功能。
Semron 的首席执行官兼联合创始人 Andreas Kunze 表示：“我们很高兴获得这笔资金，这将使我们能够进一步开发我们的 3D AI 芯片技术并将其推向市场。我们相信，我们的技术将为智能设备的未来带来革命性的变革，并为我们的客户创造巨大的价值。”
Join Capital 的合伙人 Michael Yang 表示：“Semron 拥有一个才华横溢的团队和一项变革性的技术。我们相信，他们的 3D AI 芯片将对半导体行业产生深远的影响，并为智能设备的创新开辟新的可能性。”
Semron 计划利用这笔资金扩大其研发团队，加速其 3D AI 芯片技术的开发，并与战略合作伙伴合作，将该技术推向市场。该公司预计将在未来几个月内推出其首款 3D AI 芯片产品。
英语如下：
**Headline:** Semron Raises $7.9 Million to Revolutionize AI Chipsfor Smart Devices
**Keywords:** AI chips, seed round, Semron
**Body:**
Semron, a Munich-based semiconductor startup, has announcedthe closing of a €7.3 million (approximately $7.9 million) seed funding round. The round was led by Join Capital, with participation from SquareOne, OTB Ventures, Hermann Hauser’s Onsight Ventures, and existing investors.
Semron is developing groundbreaking 3D AI chip technology thataims to transform the semiconductor landscape for smart devices. The company says its technology will significantly improve AI processing efficiency and reduce power consumption by integrating 3D memory and compute on a single chip.
Semron’s 3D AI chips will have broad applications across a range of smart devices, including smartphones, autonomous vehicles, IoT devices, and medical devices. The company says its technology will enable these devices to handle more complex tasks with greater energy efficiency, leading to smarter and more powerful capabilities.
“We are excited to have secured this funding, which will enable us to further develop our 3D AI chip technology and bring it tomarket,” said Andreas Kunze, CEO and co-founder of Semron. “We believe our technology has the potential to revolutionize the future of smart devices and create tremendous value for our customers.”
“Semron has a talented team and a transformative technology,” said Michael Yang, Partner at Join Capital. “We believe their 3D AI chips will have a profound impact on the semiconductor industry and open up new possibilities for innovation in smart devices.”
Semron plans to use the funding to expand its R&D team, accelerate the development of its 3D AI chip technology, and partner with strategic partners to bring the technology to market. The company expects to launch its first 3D AI chip products in the coming months.
【来源】https://venturebeat.com/ai/semron-raises-7-9m-for-ai-chips-with-3d-packaging/
Views: 1