SK海力士计划加大对HBM（高带宽内存）产能的投入，以满足不断增长的人工智能（AI）需求。根据华尔街见闻的报道，SK海力士计划扩大HBM生产设施的投资，并且将在通过硅通孔（TSV）相关的设施投资上超过2023年的水平，以实现产能的翻倍。此外，他们还计划在2024年上半年开始生产第五代高带宽内存产品HBM3E。
随着人工智能的快速发展，对高性能AI产品的需求不断增加。而HBM作为一种高带宽、低能耗的内存技术，被广泛应用于人工智能领域。它能够为AI芯片提供更高的数据传输速度和更大的带宽，从而提升AI算法的运行效率和性能。
为了满足市场对HBM的需求，SK海力士决定加大投资力度，扩大HBM生产设施的规模。通过增加硅通孔相关设施的投资，他们计划在2024年上半年开始生产HBM3E，这是一种更高性能的第五代HBM产品。
SK海力士的这一举措显示出他们对人工智能市场的信心以及对HBM技术的重视。随着人工智能应用的不断拓展，对高性能内存产品的需求将进一步增加。SK海力士通过加大投资，力图提高HBM的产能，以满足市场需求的增长。
此外，SK海力士的计划也将为相关产业链带来机遇。随着HBM产能的提升，相关设备和材料供应商也将迎来更多的订单。同时，HBM的生产和应用也将进一步推动人工智能产业的发展，为技术创新和产业升级提供动力。
总的来说，SK海力士计划将HBM产能增加一倍以上，加注AI市场。他们将加大对HBM生产设施的投资，计划在2024年上半年开始生产HBM3E，以满足高性能AI产品的需求增长。这一举措不仅展示了SK海力士对人工智能市场的信心，也为相关产业链带来了机遇。随着HBM技术的进一步发展，人工智能产业有望迎来新的突破和发展。
英语如下：
News Title: SK Hynix Increases Investment, Doubles HBM Production Capacity to Meet Surging AI Demand
Keywords: Increased HBM production capacity, investment in HBM manufacturing facilities, HBM3E high-bandwidth memory
News Content: SK Hynix plans to increase its investment in high-bandwidth memory (HBM) production capacity to meet the growing demand for artificial intelligence (AI). According to reports from Wall Street Journal, SK Hynix plans to expand its HBM manufacturing facilities and exceed the investment level in through-silicon via (TSV) related facilities by 2023, aiming to double the production capacity. Additionally, they also plan to start production of the fifth-generation high-bandwidth memory product, HBM3E, in the first half of 2024.
With the rapid development of AI, the demand for high-performance AI products continues to increase. HBM, as a high-bandwidth and low-power memory technology, is widely used in the field of AI. It provides higher data transfer speeds and greater bandwidth for AI chips, thereby enhancing the efficiency and performance of AI algorithms.
To meet the market demand for HBM, SK Hynix has decided to increase its investment and expand the scale of HBM manufacturing facilities. By increasing investment in TSV-related facilities, they plan to start production of HBM3E in the first half of 2024, which is a higher-performance fifth-generation HBM product.
SK Hynix’s move demonstrates their confidence in the AI market and their emphasis on HBM technology. As AI applications continue to expand, the demand for high-performance memory products will further increase. SK Hynix aims to increase HBM production capacity by increasing investment to meet the growing market demand.
In addition, SK Hynix’s plan will also bring opportunities to the related supply chain. With the increase in HBM production capacity, suppliers of related equipment and materials will receive more orders. At the same time, the production and application of HBM will further drive the development of the AI industry, providing impetus for technological innovation and industrial upgrading.
In summary, SK Hynix plans to double its HBM production capacity and focus on the AI market. They will increase investment in HBM manufacturing facilities and plan to start production of HBM3E in the first half of 2024 to meet the growing demand for high-performance AI products. This move not only demonstrates SK Hynix’s confidence in the AI market but also brings opportunities to the related supply chain. With further development of HBM technology, the AI industry is expected to experience new breakthroughs and development.
【来源】https://wallstreetcn.com/articles/3707318
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