标题：三星最新旗舰手机Galaxy S24系列搭载Exynos 2400处理器，采用先进封装技术提升散热性能
三星最新的旗舰手机Galaxy S24和S24 +将在全球部分市场搭载自家的Exynos 2400处理器。这款处理器采用了三星最新的4LPP+工艺，不仅提高了良品率，而且显著提升了芯片的能效。此外，三星还在官网上低调地披露了另一项重要技术：Fan-out Wafer Level Packaging，也就是我们常说的扇出式晶圆级封装（FOWLP）技术。这是三星首款采用FOWLP封装的智能手机SoC，这项技术为其带来了诸多好处。
FOWLP封装技术可以让Exynos 2400拥有更多的I/O连接，从而使电信号传输更加迅速，同时由于封装面积更小，散热性能也得到了显著提升。简单来说，搭载Exynos 2400的智能手机可以长时间运行而不会出现过热问题。三星宣称，使用FOWLP技术可以将Exynos 2400的散热能力提升23%，从而使多核性能提高8%。
在最新的3DMark Wild Life Extreme压力测试中，Exynos 2400取得了出色的成绩，其得分不仅是前代Exynos 2200的两倍，而且还与苹果的A17 Pro旗鼓相当。FOWLP技术无疑是Exynos 2400取得如此亮眼成绩的重要原因之一。
此外，三星Galaxy S24系列所有机型都配备了真空腔均热板散热技术，进一步降低了芯片的运行温度。如果三星已经为Exynos 2400采用了FOWLP封装技术，那么谷歌即将推出的Pixel 9和Pixel 9 Pro所搭载的Tensor G4芯片也很有可能使用同样的技术。考虑到谷歌与三星代工的关系将持续一年，FOWLP技术很有可能出现在Tensor G4芯片上。
英语如下：
Title: Samsung Galaxy S24 Series to Feature Exynos 2400 Chip with FOWLP Package for Enhanced Cooling Performance
Keywords: 1. Exynos 2400, FOWLP package, enhanced cooling performance
Content: The latest flagship smartphones from Samsung, the Galaxy S24 and S24+, are set to be equipped with the company’s own Exynos 2400 processor. This processor adopts Samsung’s latest 4LPP+ process, which not only improves yield but also significantly enhances the chip’s energy efficiency. In addition, Samsung quietly disclosed another important technology on its official website: Fan-out Wafer Level Packaging, commonly known as fan-out WLCSP (FOWLP). This is the first smartphone SoC from Samsung to adopt this FOWLP packaging technology, which brings many benefits.
The FOWLP package allows the Exynos 2400 to have more I/O connections, making electrical signal transmission faster. At the same time, due to the smaller package size, the cooling performance has also been significantly improved. In short, smartphones equipped with the Exynos 2400 can run for a long time without overheating issues. Samsung claims that using the FOWLP technology can increase the cooling capacity of the Exynos 2400 by 23%, thereby improving multi-core performance by 8%.
In the latest 3DMark Wild Life Extreme stress test, the Exynos 2400 achieved outstanding results. Its score is not only twice that of the previous generation Exynos 2200 but is also comparable to that of Apple’s A17 Pro. The FOWLP technology is undoubtedly one of the important reasons for the Exynos 2400 to achieve such impressive results.
In addition, all models of the Samsung Galaxy S24 series are equipped with vacuum cavity heat sink cooling technology, further reducing the operating temperature of the chip. If Samsung has already adopted the FOWLP packaging technology for the Exynos 2400, it is highly likely that Google’s upcoming Tensor G4 chip for the Pixel 9 and Pixel 9 Pro will also use the same technology. Considering that Google’s contract with Samsung for manufacturing will last for a year, the FOWLP technology is likely to appear on the Tensor G4 chip as well.
【来源】https://www.ithome.com/0/746/023.htm
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