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Samsung Tests W25 Foldable Phone, HDI Board Production Begins in Beijing

Samsung is reportedly testing its upcoming W25 foldable phone, with production of thekey HDI board already underway at a Beijing-based factory.

According to a report by Korean media outlet The Elec, Samsung has begun small-scale productionof components for the W25 (China) / Galaxy Z Fold Special Edition (Korea) foldable phone. The company is currently conducting reliability tests on these components.

The report further reveals that the HDI board for the W25 is being manufactured by Chinese PCB manufacturer Unimicron Technology (兴森科技). Production has commenced at their Beijing facility, with the phone expected to launch in October.

HDI Board: A Key Component for Foldable Phones

HDI, which stands for High Density Interconnect, is a crucial technology for foldable phone designs. It allows for a higher density of circuits on the PCB board, enabling smaller and thinner devices. The W25, in particular, is said to forgo the digital converter technology to achieve a thinner and lighter profile. Despite this, it will still support the S Pen.

Unimicron Technology: A Rising Star in PCB Manufacturing

Unimicron Technology, founded in 1993, has established itself as a leading PCB manufacturer. In 2022, the company completed the acquisition of Beijing IFE (揖斐电), a major player in the PCB industry. This acquisition has further strengthened Unimicron’s position in the market, making it akey supplier for Samsung’s flagship foldable phone.

Implications for the Foldable Phone Market

The news of Samsung’s W25 testing and production highlights the growing demand for foldable phones. The inclusion of the HDI board, a key component for achieving thin and lightweight designs, signifies the increasing sophistication ofthese devices.

The fact that Samsung has chosen to partner with a Chinese manufacturer for the HDI board further underscores the global nature of the foldable phone market. As the market continues to expand, we can expect to see more collaborations between companies from different regions.

References:

  • The Elec: [Link tooriginal article]
  • IT之家: [Link to original article]

Note: This article has been written based on the provided information. It is important to verify information from multiple sources before drawing conclusions.


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